In order to be competitive in global semiconductor market, Human Capital become vital and imperative.
H Consulting is determined ourselves to be the valuable partner to our clients. With our deep knowledge and competency in this field, the solutions we provide will definitely mean a lot.
Mainly support 200mm & 300mm clients, from 0.5um to advanced node(16/14nm and below). You may seek for Process Engineering, Equipment Engineering, Device Engineering, TD, R&D, IP Design, Sales, CE and others talent.
Specialized in several application, Power IC(PMIC, PMU, etc), Display Driver IC(OLED, TDDI, TFT-LCD, etc.), Touch IC, CPU/MCU(8051, ARM-based), CMOS Image Sensor(CIS), Fingerprint IC, Wireless RF IC(RFIC 2.4GHz, mmWave, Wifi, Bluetooth, etc.), Memory Controller IC(SSD, eMMC, UFS, etc.), SoC(System on Chip). You may seek for Analog Designer, Digital Designer, Software/Firmware development, system engineering, Field application Engineering and others talent.
Advanced packaging(Flip-chip, WLCSP, FOCSP, CSP, etc.) to mature packaging(bonding process), ATE solutions for diversity of IC application(Advantest platform, Teradyne platform, etc.). You may seek for Bumping Process or R&D Engineering(Solder Bump, Au bump, Copper pillar bump, etc.), Wire bond, Die bond engineering, Test Program Development, CP & FT Process/Equipment/NPI, Sales and others talent.
Etch Tool(Dry Etch, Wet Etch), Lithography, Thin Film(CVD, PVD, CMP), Diffusion(Implant, Furnace, etc.), Metrology, Bonding machine, tape & reel, etc. You may seek for installation Engineering, Field Process Engineering, Field Service Engineering, Regional Sales, Account Manager and others talents.
Support all kinds of sub-system, parts, materials, consumables vendor, e.g. CMP slurry/Pad, Specialty Gas, reclaim wafer, probe card, socket, load board, burn-in board, Trays, etc.
By our comprehensive knowledge and industry resource, we support our client with turnkey solution(one-step solution), from pin to probe card, test socket, and OSAT vendor.
For several application like AP, SoC, CIS, Display driver, etc.